xcede ram connectors. These connectors are two-piece devices that connect two printed circuit boards. xcede ram connectors

 
 These connectors are two-piece devices that connect two printed circuit boardsxcede ram connectors XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactAmphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards

XCede Plus Backplane Connector. The series offers mechanical longevity and ruggedness, guidance and keying options, and. 1 Fillets An extension of the pad at the interface of the trace to the pad that will allow more pad area in the event that the pad to hole registration compromises the interconnect area. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. You previously purchased this product. Skip to Main Content (800) 346-6873. XCede ® HD and XCede ® HD Plus, this connector provides . developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Improves signal integrity and increases signal. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. Kuject 320 PCS Heat Shrink Wire Connectors, Multipurpose Waterproof Electrical Wire Terminals kit, Insulated Crimp Connectors Ring Fork Spade Butt Splices for Automotive Marine Boat Truck. The XCede ® I/O connector supports next generation 100G+ applications and. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Login or REGISTER Hello, {0}. 三个等级的上电次序实现了热插拔. 1. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Board-to-board connector / rectangular / SMT. Check Pricing. 3. SIMM was one of the earliest multichip memory modules used in PCs, generally with 30pins and 70pins, and a 32–bit data path. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card. The XCede ® HD Plus backplane connector achieves high . 7. XCede Connectors are available at Mouser Electronics. asm jx410-51594_bp. 60mm Gen-Z connectors conform to SFF-TA-1002, OCP NIC 3. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Discover More. Up to 3. for connector repairability. FCI released XCede vertical backplane headers and right-angle daughter card receptacles designed for 25 Gb/s performance. Copper Weight and Annular Ring (“A/R”) 8 Table 3: XCede® HD 21. XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in mind. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in. backplane to expander board connector (BP_XCEDE_2) 3. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Available with 40, 60 and 80 signal pins. Features & Benefits. The system’s. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . Lukin 08/19/13 “B” S2483 Update Max force per pin spec E. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card connector or. 1 DOCUMENTS 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 4 differential signal pairs per inch are provided corresponding to a minimum slot spacing of 36 mm. ExaMAX®可实现高达56 Gbps的性能,并使设计师能够选择优化密度或最大程度地减少电路板层数。. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingBuy XCede HD2 Series Backplane Connectors. $ 173. Connectors; Diodes & Rectifiers; Embedded Processors & Controllers; Embedded Solutions; EMI/RFI Components; Enclosures;XCede High Speed / Modular Connectors are available at Mouser Electronics. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 3-, 4- and 6-pair designs. EspañolDownload XCede® Right Angle Receptacle 4-pair 8 column. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Distance Curve of MEP-12T press for XCede and XCede Plus connectors. EN. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® BACKPLANE CONNECTOR SYSTEM DESCRIPTION XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Mouser offers inventory, pricing, & datasheets for Samtec XCede High Speed / Modular Connectors. 40G QSFP+ to QSFP+ AOC Cable. 2 The daughtercard connector building blocks include signal modules, power modules,. TB-2023 Amphenol TCS Commercial Connector Qualification Plan TB-2237 XCede HD Routing Guidelines 2. 2" long and has an x4 connector. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. And each fiber cable transmits at 10Gbps. These connectors are two-piece devices that connect two printed circuit boards. Amphenol Communications Solutions. - FCI. Login or REGISTER Hello, {0}. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Change Location. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service. RAM Steel Beam Design calculates the number of studs required, accounting for the locations of maximum moments and zero moments and special distributions required due to the presence of point loads. XCede® connectors also address requirements for high linear signal density at the backplane. 3-, 4- and 6-pair designs. 99. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. This connector is a single-row, 40-pin, right-angle male header strip that can be cut or broken into smaller strips and is great for low-profile connections. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. . 三个等级的上电次序实现了热插拔. Revision SCR No. 2 TB-2244 XCede HD Family Daughtercard Connector Press-Fit Installation Process 3. 062") thick cards. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. For optimal connector configuration, connectors are grouped into signal modules of 4,. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactAmphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. 3-, 4- and 6-pair designs. XCede® HD结合了小巧的外形和优异的设计灵活性,实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案,从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. Description. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. Pin header. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal,. GR-1217-CORE-Generic Requirements for Separable Electrical Connectors used in Telecommunications. One-Piece Interface PCB Array Connectors Memory Card Connectors Custom Products VITA 42 XMC VITA 57. Buy XCede HD Plus Series Backplane Connectors. Features. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 85. XCede® connectors also address. The vertical header range also includes. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design provides flexibility in applications The XCede HD interconnect platform also has available RAM (Right Angle Male). 4. Product types are available in 3, 4 and 6. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 6. XCede High Speed/Modular Connectors are available at Mouser Electronics. The Molex EXTreme LPHPower Connector is a mixed, high current power and signal connector system that picks up where traditional connectors leave off. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. These connectors are two-piece devices that connect two printed circuit boards. These connectors are available in 3-, 4- and 6-Pair configurations. 1. Dislaime Please note that the above information is subect to change without notice. These modules consist of a 12. We would like to show you a description here but the site won’t allow us. 1. XCede HD achieves the highest performance in an HM compatible form factor. - FCI. The XCede backplane connector system provides mechanical longevity and ruggedness required by today’s systems. Get a Free Sample. 2. Login or REGISTER Hello, {0}. Formed in 2020 by a merger of three well. REPAIR PROCEDURE FOR MODULE SEE TB-2217. XCede® connectors also address. BACKPANEL CONNECTORS BACKPLANE CONNECTOR SYSTEM XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. TARGET MARKETS. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. signal connector (J_BP_SIG) 5. Accessories; Audio Products; CapacitorsAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. see tb-xxxx for board weight limitations. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. +44 (0)203 301 9900. Mouser offers inventory, pricing, & datasheets for Amphenol XCede High Speed / Modular Connectors. distance curve will begin to further increase in slope. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Male SMA connectors have a center pin and inner threads whereas female SMA connectors have. Integrated power and guidance. Applications. 80 mm高密度背板垂直插头. Search. 080 42650011. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right- angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane 1. DETAILS. Skip to Main Content (800) 346-6873. Posted 4 days ago. 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede HD PLUS & XCede HD2 press-fit connector platform is designed with partial modular reparability. 4 - Four (4) Onboardports by default . Daugtercard connectors feature Amphenol’s integral stiffener which allows designersDataspace Connector's data model is designed based on IDS-RAM. 4. 7mil Drill Minimum Pad Size vs. XCede® HD 1. TARGET MARKETS. 2. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 40G QSFP+ to QSFP+ DAC Cable. If you need to add wires, there is an additional cost: please contact us and we will help you get the order processed. Select language:Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. Connectors with six differential pairs per column fit 36 mm minimum card slot pitch and provide 82. 11. 3. 1. Features. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. connector contacts The COB system satisfies the most various installation needs thanks to the interchangeability of the connector inserts. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. challenging architectures. Additional RAM allows a computer to work with more information at the same time, which usually has a considerable effect on total system. Lukin 10/01/13 “C” “D”. Upload your CV. 0” Long. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. Search for: Search Home; Categories. Contact Mouser (USA) (800) 346-6873 | Feedback. For XCede HD RAM and XCede HD Inverted RAM refer to this documents. Available for SOLIDWORKS, Inventor, Creo, CATIA, Solid Edge, autoCAD, Revit and many more CAD software but also as STEP, STL, IGES, STL, DWG, DXF and more neutral CAD formats. XCede Daughter Card PWB + Fixture Thickness Requirements and Compliant Pin Protrusion Lengths XCede Connector Type/Size PWB + Fixture Thickness Minimum (mm) 0. EN. info@xcede. We would like to show you a description here but the site won’t allow us. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThe XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 2 Reference Documents TB-2235 XCede HD General Product Specifications TB-2237 XCede HD Routing Guidelines TB-2252 XCede HD Backplane Connector Installation 2. XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. B S4329 Added XCede HD PLUS backplane information B. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators. 3. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). Description Initial Date “-“ S1188 Initial Release T. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed / Modular Connectors. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. $19. 8 mm, Header, Press Fit. XCede® Connectors - Amphenol CS | DigiKey2020 Dodge Ram 1500 TIPM Module Connector (G36C42) TIPM Module Connector (G36C42) (3) List Price. Login or REGISTER Hello, {0}. Basics is present with its full range of products to meet the needs of our customers. XCede. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures. DC Connector Configurations XCede HD connector system. 2. XCede ® HD Plus. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. XCede ® HD2 § XCede ® and AirMax are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. 2. 32. 10120130-Y0J-20DLF Datasheets | Backplane Connectors Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Right By apogeeweb, 10120130-Y0J-20DLF, 10120130-Y0J-20DLF Datasheet,10120130-Y0J-20DLF PDF,Amphenol ICC (FCI)XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede. Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. DC connector configurations are determined by the customers’ system application. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThis document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). XCede® HD 1. The SMA (or Sub-Miniature A) connector has a 50Ω impedance and can handle frequencies up to 17 GHz. XCede ® HD2 §Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. Español $ USD United States. Here's a hint for each of the word groups in today's Connections puzzle, plus a couple more clues to help you find the answer:. Rugged Edge Rate® contact system. 2. PCIe Gen. Role: Data Engineer Salary: up to €95k (DOE) + Benefits Remote Working Policy: Fully remote available Location: Mainz (fully remote) Tech Stack: Spark/Hadoop, Data Lake, AWS/Azure, Python, Kafka, Airflow, Docker, CI/CD. Login or REGISTER Hello, {0}. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. 4-, 5-, 6-, 8-pair configurations. Spacone 5-29-12 XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. XCede. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. 1. Available in industry-standard 2. XCede® Connectors - Amphenol CS | DigiKeyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® Family Cable Assemblies § Extends the reach of passive copper for next generation real world system designs; complementary with direct orthogonal designs, intermatable with existing board mount connector designs § Lowers overall system costs by reducing or eliminating the need for expensive active devices like retimers and high TB-2253 XCede HD Family Daughtercard Wafer Removal and Replacement. 6. 6amps per mm. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. Resource The top level of the. 2. 2. DC Connector Configurations. Buy 928-4050-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Plus Series, Receptacle, Press Fit. Vertical or Right Angle. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 96 and 5. XCede® Connectors - Amphenol CS | DigiKeyFounded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. Mouser offers inventory, pricing, & datasheets for Amphenol XCede HD Series High Speed / Modular Connectors. These connectors are two-piece devices that connect two printed circuit boards. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 0 REFERENCE 2. refer to c-922-4x0a-500 for signal connector detail. 00: L: Pressfit: 5: Power or coax contacts, Multi Purpose Centre, Location Peg1. 2. Scalable upgrades to 56Gb/s. AMPHENOL COMMUNICATIONS SOLUTIONS. Contact us today for more details of XCede HD, part number 968-4200-A1H. My main workstation is based on Ryzen 7 5800X, Asus Crosshair VIII Dark Hero, 64 GB RAM, 1TB Samsung 980 PRO SSD, EVGA RTX 3070ti FTW3 GPU, etc. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. They're small enough for most consumer RF applications and they use a threaded housing to create strong mechanical connections. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Pitch (mm): Circuits: Current (MAX per contact): Voltage: 1. Integrated power and guidance. 11. XCede HD achieves the highest performance in an HM compatible form factor. c-jx410-51594 a creo files jx410-51594_bp . See Figure 15 for details. Login or REGISTER Hello, {0}. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. power connector (J_PWR_A) 6. EspañolAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®. BENEFITS. XCede® connectors also address. 96 and 5. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Contact us today for more details of XCede, part number 922-440G-F3H Toggle Nav. backplane to expander board connector (BP_XCEDE_3) 2. Electrical & Mechanical Models. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. Features. Amphenol Communications Solutions XCede high-performance backplane connector system. 28G ADDITION TO THE XCEDE ® HD FAMILY XCede ® HD plus leverages the same. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Motherboard Diagram. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 4-, 5-, 6-, 8-pair configurations. BAcKpAneL connectors Fci’s Xcede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. XCede® connectors also. was founded in 1987 with the mission of becoming a specialty connector manufacturer, delivering highest quality products and providing unparalleled customer service. 3. 4, 6 or 8 columns. XCede® connectors also address. The company manufactures MIL-DTL-5015, both Front and Rear Release versions, MIL-DTL-83723 Series III, MIL-DTL-28748 rack and panel, Reverse Bayonet, and. XCede® RAM. DETAILS. XCede® connectors also address. Login or REGISTER Hello, {0}. XCede connectors also meet higher linear signal density requirements at backplane or midplane interfaces. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Login or REGISTER Hello, {0}. C&K Components. 10119128-B0C-40DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Left By apogeeweb, 10119128-b0c-40dlf, 10119128-b0c-40dlf datasheet,10119128. Description. High-density backplane system – up to 84 differential pairs per linear inch. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. 08mm. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. 54, 3. XCede HD achieves the highest performance in an HM compatible form factor. 4. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 3. Contact us today for more details of XCede HD, part number 968-4200-A1H. Features. 80mm Right-Angle Backplane Receptacle; HDTF - Samtec XCede® HD 1. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. 00mm: 2 - 54: 1. 6. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Backwards mate compatibility. Four-pair connectors provide 54. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. 00 mm contact wipe on signal pins. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. XCede® connectors also address. Find Parts Learn More. Amphenol Xcede Series High Speed / Modular Connectors are available at Mouser Electronics.